Lattice Semiconductor Launches Low-Cost, Non-Volatile FPGAs

HILLSBORO, Ore.—(BUSINESS WIRE)—Feb. 28, 2005— Lattice Semiconductor Corporation (Nasdaq:LSCC):

-- "No Compromise" Flash-based LatticeXP FPGAs are Instant-On, Infinitely Reconfigurable

-- Devices Move Swiftly to Market with Immediate Availability of First Device Samples

Lattice Semiconductor Corporation (Nasdaq:LSCC) today announced its new LatticeXP(TM) devices, which combine a low-cost FPGA architecture with non-volatile, infinitely reconfigurable ispXP(TM) (eXpanded Programmability) technology. The LatticeXP devices deliver the benefits of instant-on operation, excellent security and a single-chip implementation and provide cost-effective alternatives to SRAM-based FPGAs and their associated boot memories. Through advanced 130nm Flash silicon technology, an optimized architecture and proprietary circuit design, die sizes of the new LatticeXP devices have been reduced over 80% compared to the previous generation of Lattice non-volatile FPGAs. First samples of the 10K Look-Up Table (LUT) LatticeXP10 device are now available with the remaining 4 family members planned for second quarter availability.

"Lattice first delivered volume, non-volatile FPGAs to the marketplace in 2003, and our customers responded positively," said Cyrus Tsui, Lattice Chairman and CEO. "However, customers also told us that to expand their use of this 'ultimate' FPGA technology they required prices more consistent with that of SRAM-based FPGAs plus the associated boot PROMs. This new generation of LatticeXP products makes non-volatility finally affordable for the growing number of users who prefer a non-volatile solution. This unmet demand represents a large opportunity for Lattice that has not been addressed by the dominant FPGA market players."

LatticeXP devices are implemented on a cost effective, low-k, 130nm CMOS Flash process using copper metallization. The technology was co-developed by Fujitsu Limited and Lattice Semiconductor. Production wafers are fabricated by Fujitsu in their state-of-the-art wafer fab. The devices support operation from 1.2-, 1.8-, 2.5-, or 3.3-volt power supplies.

Best of Both Worlds: ispXP Technology

The ispXP technology used in the LatticeXP devices combines SRAM and non-volatile Flash memory to deliver an FPGA that is both non-volatile and infinitely reconfigurable. "Customers have told us that the concept of a non-volatile, infinitely reconfigurable FPGA, with its associated one-chip solution benefits of instant-on operation and security, represents the FPGA 'promised land,'" said Stan Kopec, vice president of marketing for Lattice. "With such an FPGA, customers would have the best of both worlds: the infinite reconfigurability of SRAM and the many benefits of non-volatility.

"Now the concept is reality," Kopec continued. "We believe the LatticeXP will rapidly become the 'no compromise' FPGA for cost-conscious, high-volume applications."

The SRAM-based memory cells control the operation of the device logic and are loaded from the on-chip Flash memory in less than 1mS at power-up, providing instant-on capability, or boot up on user command. The products can also be configured via a microprocessor interface, referred to as the sysCONFIG(TM) interface, or the JTAG interface.

Unlike traditional SRAM-based FPGAs, the LatticeXP device does not require an external boot memory and so provides a single-chip solution with the associated benefits of reduced board area and simplified system manufacture. The absence of an external boot device also eliminates the need for an external bit-stream at boot up and the possibility of bit-stream snooping, a major security concern with SRAM FPGAs. Security features prohibit bit-stream readback from the SRAM and Flash sections of the devices to further enhance security.

Richard Wawrzyniak, Senior Analyst, ASIC and SoC, with Semico Research Corp. said, "The new, Flash-based XP family of FPGAs from Lattice Semiconductor continues to lower the threshold at which designers can consider using FPGAs as their design solution. The Non-Volatility feature, combined with low price points and increased device performance, will open many existing applications to FPGAs along with empowering new, unanticipated applications. Lattice is to be commended for delivering the popular Non-Volatility feature in their FPGAs just as designers are awakening to the potential Flash-based parts bring to the market. Semico believes Non-Volatility coupled with the FPGA architecture will be a powerful aid to the design community in the immediate future."

Optimized Architecture for Cost-Conscious, High-Volume Designs

Developed Concurrently With LatticeECP/EC Devices

The LatticeXP architecture was developed concurrently, and from the "ground up," with that of the previously announced LatticeECP(TM)/LatticeEC(TM) FPGAs. As with the low-cost LatticeECP/EC devices, all LatticeXP architectural elements such as logic blocks, I/O capabilities including DDR support and embedded memory, among others, were evaluated in the context of their targeted high-volume applications as the devices were defined. The feature sets were then precisely sculpted to be neither excessive (driving up cost) nor "bare bones" (limiting the application range) in order to maximize their broad adoption. The resulting combination of a superior streamlined architecture, compact circuit design and production-proven technology found in the LatticeXP devices allows them to provide the benefits of non-volatile, infinitely reconfigurable FPGAs and to be cost-effective alternatives to SRAM-based FPGAs and their associated boot memories.

Gerald S. (Jerry) Worchel, Principal Analyst, ASIC/ASSP and Intellectual Property Service with In-Stat, said, "With the introduction of its non-volatile, Flash-based XP FPGA family, Lattice continues to expand its presence and influence in the FPGA marketplace. Combined with last year's ECP/EC introduction, and a promised announcement later this year of a high-end FPGA, Lattice is becoming a force to be reckoned with. Increasingly, Lattice is a legitimate FPGA competitor and alternative to the market leaders."

The LatticeXP devices will be offered in a range of 5 densities, from 3K to 20K LUTs. The devices provide I/O counts from 62 to 340 in a variety of low-cost Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP) and 1mm fine-pitch Ball Grid Array (fpBGA) packaging.

A Closer Look: LatticeXP Optimized Architecture

-- Based upon industry-standard, synthesis-friendly 4-input look-up table (LUT) logic blocks.

-- Twenty-five percent of the logic blocks contain distributed memory, an optimization that reduces cost while supporting the vast majority of application requirements for small amounts of distributed memory.

-- The availability of sysCLOCK(TM) Phase Locked Loops (PLLs) and Embedded Block RAMs (EBRs) allows designers to reduce costs further by integrating these functions within the FPGA, eliminating external discrete devices.

-- Advanced sysI/O(TM) buffer capability supports standards such as LVCMOS, LVDS, LVTTL and PCI, as well as SSTL and HSTL, allowing users to easily and efficiently interface to the industry's most popular bus standards. These standards were carefully selected to maximize application range while minimizing die area.

-- The LatticeXP devices have dedicated circuitry to simplify DDR memory interfaces, while providing the highest performance, integration, signal integrity and ease of design for FPGAs in this class. DDR memory has become the low-cost memory of choice: estimates suggest DDR represented 75% of DRAM bits shipped in 2004, up from 39% in 2002.

Design Tools and IP Support

In addition to a common FPGA architecture, the LatticeEC, LatticeECP and LatticeXP devices share a common design methodology and design tool flow supported by the Lattice ispLEVER(R) design tool suite. Lattice ispLEVER software provides designers with access, in one software package, to all Lattice digital devices and includes synthesis support using Mentor Graphics Precision RTL and Synplicity Synplify design tools. The ispLEVER Version 4.2 Service Pack 1 provides initial LatticeXP support.

An extensive range of IP (intellectual property) cores, particularly suited for high-volume applications, will be available from both Lattice and its IP partners. Complete details of IP support will be announced throughout 2005.

Availability and Pricing

-- Samples of the first device, the 10K LUT LatticeXP10, are available now with the remainder of the family expected to sample during the first half of 2005.

-- These devices feature 216Kbits of Embedded Block RAM and either 188 (256 fpBGA) or 244 (388 fpBGA) general-purpose I/O pins.

-- The published price in 1K quantities for immediate shipment of the XP10 in the 256 fpBGA package is $32.95. Volume prices (250K units+) in 2006 are projected to be less than $15.

About Lattice Semiconductor

Lattice Semiconductor Corporation designs, develops and markets the broadest range of Field Programmable Gate Arrays (FPGA), Field Programmable System Chips (FPSC) and high-performance Programmable Logic Devices (PLD), including Complex Programmable Logic Devices (CPLD), Programmable Mixed-Signal Products (ispPAC(R)), and Programmable Digital Interconnect Devices (ispGDX(R)). Lattice also offers industry-leading SERDES products. Lattice is "Bringing the Best Together" with comprehensive solutions for today's system designs, delivering innovative programmable silicon products that embody leading-edge system expertise.

Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in communications, computing, consumer, industrial and military end markets. Company headquarters are located at 5555 NE Moore Court, Hillsboro, Oregon 97124-6421, USA; telephone: 503-268-8000, fax: 503-268-8037. For more information about Lattice Semiconductor Corporation, visit http://www.latticesemi.com.

Statements in this news release looking forward in time are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements, including estimates of market growth and composition, involve risks and uncertainties, including market acceptance and demand for our new products, our dependencies on our silicon wafer suppliers, the impact of competitive products and pricing, technological and product development risks and other risk factors detailed in the Company's Securities and Exchange Commission filings. Actual results may differ materially from forward-looking statements.

Lattice Semiconductor Corporation, Lattice (& design), L (& design), LatticeECP, LatticeEC, LatticeXP, ISP, ispLEVER, ispXP, ispGDX, ispPAC, sysCLOCK, sysCONFIG, sysI/O, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

Lattice Semiconductor Corporation, Hillsboro
Brian Kiernan, 503-268-8739 (voice); 503-268-8193 (fax)
brian.kiernan@latticesemi.com